Back
3D TIM
3D TIM Thermal Interface Materials
Efficient thermal management for complex electronics
Rising power densities and compact designs require more than standard thermal interface solutions. 3D TIM materials from Freudenberg combine thermal conductivity, electrical insulation, and mechanical integration in a single, customized 3D component—ensuring reliable heat transfer even in demanding applications.
Key Benefits
-
Optimized heat transfer through customized 3D design
-
Electrical insulation combined with thermal conductivity
-
Reduced assembly effort and system complexity
-
Reliable performance in high-load environments
Typical Applications
-
PCB and electronic component cooling
-
Busbar thermal management in battery systems
-
E mobility, power electronics, and energy systems
Integrated Design Advantage
3D TIM enables precise adaptation to complex geometries with controlled thickness and stable integration.
This allows efficient heat dissipation, improved reliability, and optional functional integration - such as combining thermal management and electrical insulation in one component.
Join Us!
Experience Freudenberg Sealing Technologies, its products and service offerings in text and videos, network with colleagues and stakeholders, and make valuable business contacts.
Back to Top